Discover the current pain points for operators of data centers and semiconductor fabrication, including stringent ultrapure water (UPW) standards and monitoring as well as propylene glycol (PG25) quality in direct liquid cooling (DLC) applications. Other topics will include corrosion and material compatibility issues as well as solutions for current and future industry challenges.

Key Takeaways:

• Pain points impacting operators today
• Operational resilience and the handling of various demands
• Industry solutions to meet current and future requirements